Patent Assignment
Reel/Frame 062385/0827
Assignment of Assignor's Interest
Recorded: 2023-01-17
Pages: 3
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI, GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Barrier Dielectric Layer Including Ferroelectric Material
Application:
18/097,493 →
Publication:
US 2024/0081082