Patent Assignment
Reel/Frame 062395/0643
Assignment of Assignor's Interest
Recorded: 2023-01-17
Pages: 7
Assignors
HOO, YENG KWAN
Executed: 2023-01-11
KREFFT, ANNA KATHARINA
Executed: 2023-01-11
TOPAL, EMRE
Executed: 2023-01-11
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Integrated Bare Die Package, and Related Fabrication Methods
Application:
18/066,448 →
Publication:
US 2024/0203938