Patent Assignment
Reel/Frame 062403/0831
Assignment of Assignor's Interest
Recorded: 2023-01-18
Pages: 6
Assignors
YOON, DUSEOP
Executed: 2022-12-02
KWON, JUNYOUNG
Executed: 2022-12-02
SEOL, MINSU
Executed: 2022-12-05
YOO, MINSEOK
Executed: 2022-12-02
BYUN, KYUNG-EUN
Executed: 2022-12-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Two-Dimensional Material and Method of Manufacturing the Same
Application:
18/152,976 →
Publication:
US 2024/0021683