Patent Assignment
Reel/Frame 062410/0225
Assignment of Assignor's Interest
Recorded: 2023-01-18
Pages: 4
Assignors
LEE, MENG-JIE
Executed: 2022-12-20
LIN, CHIH-NAN
Executed: 2022-12-20
YAN, CI-HONG
Executed: 2022-12-20
KAO, NAI-HAO
Executed: 2022-12-20
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
DAFENG RD., TANZI DIST.,, NO.123, SEC. 3,, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Electronic Package and Manufacturing Method Thereof
Application:
18/155,337 →
Publication:
US 2024/0145455