Electronic package and manufacturing method thereof
An electronic package is provided, in which an electronic module including a first electronic element and a second electronic element is disposed on a carrier structure embedded with a third electronic element, and the third electronic element is a photonic chip electrically connected to the electronic module. Therefore, with this configuration, it is beneficial to reduce a layout area of the carrier structure to meet the requirement of miniaturization.
1 . An electronic package, comprising:
a carrier structure;
an electronic module disposed on the carrier structure, wherein the electronic module comprises an encapsulation layer having a first surface and a second surface opposing the first surface, a first electronic element embedded in the encapsulation layer, conductive pillars embedded in the encapsulation layer, a circuit structure disposed on the first surface of the encapsulation layer and electrically connected to the first electronic element and the conductive pillars, and at least two second electronic elements disposed on and electrically connected to the circuit structure, wherein the first electronic element is electrically connected to the at least two second electronic elements to serve as a bridge die, and a redistribution layer including an insulating layer and a routing structure is formed on a bottom side of the bridge die; and
a third electronic element embedded in the carrier structure and electrically connected to the electronic module, wherein the third electronic element is a photo IC, wherein the third electronic element is partially exposed from the carrier structure and the electronic module, and the exposed third electronic element is connected to an optical fiber disposed on the carrier structure.
2 . The electronic package of claim 1 , wherein the third electronic element is disposed on the second surface of the encapsulation layer via conductive bumps and is electrically connected to the conductive pillars.
3 . The electronic package of claim 1 , wherein the carrier structure has a groove to accommodate the third electronic element.
4 . The electronic package of claim 1 , wherein the first electronic element or one of the at least two second electronic elements is a switch die.
5 . The electronic package of claim 4 , wherein one of the at least two second electronic elements is the switch die.
6 . The electronic package of claim 1 , wherein the routing structure is disposed on the second surface of the encapsulation layer and electrically connected to the conductive pillars.
7 . The electronic package of claim 6 , wherein the third electronic element is electrically connected to the routing structure.
8 . The electronic package of claim 1 , wherein the electronic module further comprises a packaging layer covering the at least two second electronic elements.
9 . A method of manufacturing an electronic package, comprising:
providing an electronic module, wherein the electronic module comprises an encapsulation layer having a first surface and a second surface opposing the first surface, a first electronic element embedded in the encapsulation layer, conductive pillars embedded in the encapsulation layer, a circuit structure disposed on the first surface of the encapsulation layer and electrically connected to the first electronic element and the conductive pillars, and at least two second electronic elements disposed on and electrically connected to the circuit structure, wherein the first electronic element is electrically connected to the at least two second electronic elements to serve as a bridge die, and a redistribution layer including an insulating layer and a routing structure is formed on a bottom side of the bridge die;
electrically connecting a third electronic element to the electronic module, wherein the third electronic element is a photo IC; and
disposing the electronic module on a carrier structure, wherein the third electronic element is embedded in the carrier structure, wherein the third electronic element is partially exposed from the carrier structure and the electronic module, and the exposed third electronic element is connected to an optical fiber disposed on the carrier structure.
10 . The method of claim 9 , wherein the third electronic element is disposed on the second surface of the encapsulation layer via conductive bumps and is electrically connected to the conductive pillars.
11 . The method of claim 9 , wherein the carrier structure has a groove to accommodate the third electronic element.
12 . The method of claim 9 , wherein the first electronic element or one of the at least two second electronic elements is a switch die.
13 . The method of claim 12 , wherein one of the at least two second electronic elements is the switch die.
14 . The method of claim 9 , wherein the routing structure is disposed on the second surface of the encapsulation layer and electrically connected to the conductive pillars.
15 . The method of claim 14 , wherein the third electronic element is electrically connected to the routing structure.
16 . The method of claim 9 , wherein the electronic module further comprises a packaging layer covering the at least two second electronic elements.