Patent Assignment
Reel/Frame 062421/0894
Assignment of Assignor's Interest
Recorded: 2023-01-19
Pages: 7
Assignors
PARK, CHANGJUN
Executed: 2022-12-07
LEE, JAESUNG
Executed: 2022-11-18
LIM, JUNGHUN
Executed: 2022-11-20
OH, JUNGMIN
Executed: 2022-12-02
BAE, SANGWON
Executed: 2022-11-23
LEE, HYOSAN
Executed: 2022-12-02
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
SOULBRAIN CO., LTD.
34, PANGYO-RO 255BEON-GIL, BUNDANG-GU, SEONGNAM-SI, GYEONGGI-DO, 13486, KOREA, REPUBLIC OF
Covered Property
(1)
Etchant Composition for Etching Silicon Germanium Film and Method of Manufacturing Integrated Circuit Device by Using the Same