Etchant composition for etching silicon germanium film and method of manufacturing integrated circuit device by using the same
An etchant composition for etching a silicon germanium film includes, based on a total weight of the etchant composition, about 5 wt % to about 14 wt % of an oxidant, about 0.01 wt % to about 5 wt % of a fluorine compound, about 0.01 wt % to about 5 wt % of an amine compound, about 0.01 wt % to about 1 wt % of an alcohol compound having a hydrophilic head and a hydrophobic tail, about 60 wt % to about 90 wt % of an organic solvent, and a balance of water. A method of manufacturing an integrated circuit device includes: forming, on a substrate, a structure in which a plurality of silicon films and a plurality of silicon germanium films are alternately stacked; and selectively removing the plurality of silicon germanium films by using the etchant composition.
1. A method of manufacturing an integrated circuit device, the method comprising:
forming, on a substrate, a structure in which a plurality of silicon films and a plurality of silicon germanium films are alternately stacked; and
selectively removing the plurality of silicon germanium films from among the plurality of silicon films by using an etchant composition,
wherein the etchant composition includes:
about 5 wt % to about 14 wt % of an oxidant, based on a total weight of the etchant composition;
about 0.01 wt % to about 5 wt % of a fluorine compound, based on the total weight of the etchant composition;
about 0.01 wt % to about 5 wt % of an amine compound, based on the total weight of the etchant composition;
about 0.01 wt % to about 1 wt % of an alcohol compound having a hydrophilic head and a hydrophobic tail, based on the total weight of the etchant composition;
about 60 wt % to about 90 wt % of an organic solvent, based on the total weight of the etchant composition; and
a balance of water.
2. The method as claimed in claim 1 , wherein:
in the forming of the structure, each of the plurality of silicon films and the plurality of silicon germanium films is formed by an epitaxial growth process,
each of the plurality of silicon films includes a single-crystal silicon film, and
a germanium content in each of the plurality of silicon germanium films is in a range of about 10 at % to about 20 at %.
3. The method as claimed in claim 1 , further comprising, after the forming of the structure, forming a silicon nitride film to cover a sidewall of the structure, wherein:
the plurality of silicon germanium films are selectively removed from among the silicon nitride film and the plurality of silicon films by using the etchant composition, and
after selectively removing the plurality of silicon germanium films, the silicon nitride film and the plurality of silicon films are exposed in spaces from which the plurality of silicon germanium films are removed.
4. The method as claimed in claim 1 , wherein, in the etchant composition, the oxidant includes a C1-C6 carboxylic acid compound, a C1-C6 peroxyacid compound, or a combination thereof.
5. The method as claimed in claim 1 , wherein, in the etchant composition, the fluorine compound includes hydrofluoric acid (HF), sodium fluoride (NaF), potassium fluoride (KF), aluminum fluoride (AlF 3 ), lithium fluoride (LiF), calcium fluoride (CaF 2 ), ammonium fluoride (NH 4 F), ammonium difluoride (NH 4 HF 2 ), tetramethylammonium fluoride ((CH 3 ) 4 NF), potassium bifluoride (KHF 2 ), fluoroboric acid (HBF 4 ), ammonium tetrafluoroborate (NH 4 BF 4 ), potassium fluoroborate (KBF 4 ), hexafluorosilicic acid (H 2 SiF 6 ), or a combination thereof.
6. The method as claimed in claim 1 , wherein, in the etchant composition, the amine compound is selected from a C1-C8 aliphatic amine compound and a 5- to 8-membered cyclic amine.
7. The method as claimed in claim 1 , wherein, in the etchant composition, the alcohol compound includes a polyhydric alcohol having a C8-C16 normal alkyl group and at least two hydroxyl groups.
8. The method as claimed in claim 1 , wherein, in the etchant composition, the organic solvent includes a C1-C5 carboxylic acid compound.
9. A method of manufacturing an integrated circuit device, the method comprising:
forming, on a substrate, a mold layer in which a plurality of silicon films and a plurality of silicon germanium films are alternately stacked;
forming an insulating structure to cover a sidewall of the mold layer;
forming a mold pattern by forming a trench through anisotropic etching of the plurality of silicon films and the plurality of silicon germanium films, the mold pattern including respective remaining portions of the plurality of silicon films and the plurality of silicon germanium films, which define the trench; and
forming a plurality of air gaps by selectively removing, from the mold pattern, the plurality of silicon germanium films through the trench by using an etchant composition, the plurality of air gaps exposing the plurality of silicon films and the insulating structure,
wherein the etchant composition includes:
about 5 wt % to about 14 wt % of an oxidant, based on a total weight of the etchant composition;
about 0.01 wt % to about 5 wt % of a fluorine compound, based on the total weight of the etchant composition;
about 0.01 wt % to about 5 wt % of an amine compound, based on the total weight of the etchant composition;
about 0.01 wt % to about 1 wt % of an alcohol compound having a hydrophilic head and a hydrophobic tail, based on the total weight of the etchant composition;
about 60 wt % to about 90 wt % of an organic solvent, based on the total weight of the etchant composition; and
a balance of water.
10. The method as claimed in claim 9 , wherein:
each of the plurality of silicon films includes a single-crystal silicon film, and
a germanium content in each of the plurality of silicon germanium films is selected from a range of about 10 at % to about 20 at %.
11. The method as claimed in claim 9 , wherein:
the insulating structure includes a silicon nitride film contacting a sidewall of each of the plurality of silicon films and the plurality of silicon germanium films, and
in the forming of the plurality of air gaps, the silicon nitride film is exposed by the plurality of air gaps.
12. The method as claimed in claim 9 , wherein, in the etchant composition,
the oxidant includes peracetic acid, performic acid, acetic acid, formic acid, propionic acid, or a combination thereof,
the fluorine compound includes hydrofluoric acid (HF),
the amine compound includes a C1-C8 aliphatic polyamine,
the alcohol compound includes a C8-C16 alkane-1,2-diol, and
the organic solvent includes acetic acid.
13. The method as claimed in claim 9 , wherein:
the etchant composition further includes about 0.01 wt % to about 5 wt % of a catalyst, based on the total weight of the etchant composition, and
the catalyst includes sulfuric acid or methanesulfonic acid.