Patent Assignment
Reel/Frame 062472/0597
Assignment of Assignor's Interest
Recorded: 2023-01-24
Pages: 6
Assignors
KWON, DONGHOON
Executed: 2022-11-22
YOON, BOUN
Executed: 2022-11-24
JANG, KIHOON
Executed: 2022-11-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Pad and Substrate Processing Apparatus Including the Same