Patent Assignment
Reel/Frame 062496/0951
Assignment of Assignor's Interest
Recorded: 2023-01-26
Pages: 7
Assignors
YOU, SORA
Executed: 2023-01-02
LEE, KYOUNGWOO
Executed: 2023-01-02
LEE, SUNGMOON
Executed: 2023-01-02
CHA, SEUNGMIN
Executed: 2022-12-30
CHO, HAGJU
Executed: 2023-01-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same