IP Library › Assignment 062535/0382
Patent Assignment
Reel/Frame 062535/0382

Assignment of Assignor's Interest

Recorded: 2023-01-30 Pages: 7
Assignors
HINER, DAVID
Executed: 2022-03-10
KELLY, MICHAEL
Executed: 2023-01-25
HUEMOELLER, RONALD
Executed: 2022-03-15
Assignee
AMKOR TECHNOLOGY, INC.
2045 EAST INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Package and Fabricating Method Thereof
Application: 18/098,782 →
Publication: US 2023/0154893
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 30, 2023
From: MOK, IN SU; LEE, SANG HYOUN; DO, WON CHUL; KHIM, JIN YOUNG
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 062536/0011 →
Assignment of Assignor's Interest Jan 31, 2023
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 062544/0186 →
Assignment of Assignor's Interest Jan 31, 2023
From: AMKOR TECHNOLOGY KOREA, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 062570/0896 →