Patent Assignment
Reel/Frame 062536/0011
Assignment of Assignor's Interest
Recorded: 2023-01-30
Pages: 12
Assignors
MOK, IN SU
Executed: 2022-03-03
LEE, SANG HYOUN
Executed: 2022-03-04
DO, WON CHUL
Executed: 2022-03-04
KHIM, JIN YOUNG
Executed: 2022-03-04
YONG, GAM HAN
Executed: 2022-03-04
JEONG, MIN SU
Executed: 2022-03-04
LEE, JI HUN
Executed: 2022-03-04
Assignee
AMKOR TECHNOLOGY KOREA, INC.
100, AMKOR-RO, BUK-GU, GWANGJU, 61006, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Fabricating Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 30, 2023
From: HINER, DAVID; KELLY, MICHAEL; HUEMOELLER, RONALD
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 062535/0382 →
Assignment of Assignor's Interest
Jan 31, 2023
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 062544/0186 →
Assignment of Assignor's Interest
Jan 31, 2023
From: AMKOR TECHNOLOGY KOREA, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 062570/0896 →