Patent Assignment
Reel/Frame 062541/0842
Assignment of Assignor's Interest
Recorded: 2023-01-31
Pages: 6
Assignors
CHOI, JUIL
Executed: 2022-11-03
KANG, JUSUK
Executed: 2022-11-03
PARK, HYUNGJUN
Executed: 2022-11-03
OH, SANGHYUCK
Executed: 2022-11-03
LEE, HYUNJU
Executed: 2022-11-03
CHOI, SANGYEOL
Executed: 2022-11-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Heat Dissipation Structure
Application:
18/095,642 →
Publication:
US 2023/0361046