Patent Assignment
Reel/Frame 062565/0195
Assignment of Assignor's Interest
Recorded: 2023-02-01
Pages: 3
Assignee
TEXAS INSTRUMENTS INCORPORATED
12500 TI BOULEVARD, MS 3999, DALLAS, TEXAS, 75243
Covered Property
(1)
Semiconductor Package Substrate with a Smooth Groove Straddling Topside and Sidewall