Patent Assignment
Reel/Frame 062568/0861
Assignment of Assignor's Interest
Recorded: 2023-02-02
Pages: 3
Assignor
LIAW, JHON JHY
Executed: 2023-02-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Manufacturing for Forming Source/Drain Contact Features and Devices Manufactured Thereof