Patent Assignment
Reel/Frame 062603/0055
Assignment of Assignor's Interest
Recorded: 2023-02-06
Pages: 5
Assignors
LEE, HYEOKJONG
Executed: 2023-01-16
KWON, MINHO
Executed: 2023-01-16
CHO, KYONGSOON
Executed: 2023-01-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Semiconductor Chips Stacked in a Multi-Layer Structure by a Flip-Chip Bonding Method