Patent Assignment
Reel/Frame 062647/0849
Assignment of Assignor's Interest
Recorded: 2023-02-10
Pages: 3
Assignors
CHEN, YI-REN
Executed: 2022-09-25
LI, CHUNG-TING
Executed: 2022-09-25
CHANG, SHIH-HSUN
Executed: 2022-09-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same