Patent Assignment
Reel/Frame 062647/0933
Assignment of Assignor's Interest
Recorded: 2023-02-10
Pages: 5
Assignors
WANG, CHUEI-TANG
Executed: 2022-09-05
CHANG, TSO-JUNG
Executed: 2022-09-06
HSIEH, JENG-SHIEN
Executed: 2022-09-06
LIN, SHIH-PING
Executed: 2022-09-06
LIN, CHIH-PENG
Executed: 2022-09-06
CHEN, CHIEH-YEN
Executed: 2022-09-06
YU, CHEN-HUA
Executed: 2022-11-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure with Vertical Connection Structure and Manufacturing Method Thereof
Application:
18/152,740 →
Publication:
US 2024/0079392