Patent Assignment
Reel/Frame 062679/0978
Assignment of Assignor's Interest
Recorded: 2023-02-13
Pages: 3
Assignors
PAN, KUAN-TING
Executed: 2021-03-15
CHIANG, KUO-CHENG
Executed: 2021-03-15
WANG, PEI-YU
Executed: 2021-03-14
CHUNG, CHENG-TING
Executed: 2021-03-15
WANG, CHIH-HAO
Executed: 2021-03-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Methods of Forming the Same