Patent Assignment
Reel/Frame 062729/0892
Assignment of Assignor's Interest
Recorded: 2023-02-17
Pages: 5
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 1010045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Plasma Generating Apparatus
Application:
18/170,289 →
Publication:
US 2023/0197408