Patent Assignment
Reel/Frame 062739/0233
Assignment of Assignor's Interest
Recorded: 2023-02-20
Pages: 4
Assignors
HSIEH, CHIA-HAN
Executed: 2022-10-12
HU, YU-JIN
Executed: 2022-10-17
TSENG, HUA-WEI
Executed: 2022-10-13
SU, AN-JHIH
Executed: 2022-10-13
YEH, DER-CHYANG
Executed: 2022-10-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Forming the Same