Patent Assignment
Reel/Frame 062753/0624
Assignment of Assignor's Interest
Recorded: 2023-02-21
Pages: 5
Assignors
PENG, TAI-YEN
Executed: 2017-10-20
WEI, HUI-HSIEN
Executed: 2017-10-19
WEN, WEI-CHIH
Executed: 2017-10-20
DAI, PIN-REN
Executed: 2017-10-20
LEE, CHIEN-MIN
Executed: 2017-10-20
TSAI, HAN-TING
Executed: 2017-10-20
SHIEH, JYU-HORNG
Executed: 2017-10-20
LIN, CHUNG-TE
Executed: 2017-10-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Structure