Patent Assignment
Reel/Frame 062757/0161
Assignment of Assignor's Interest
Recorded: 2023-02-21
Pages: 4
Assignors
LIU, JUN-YE
Executed: 2022-09-25
YANG, JIH-SHENG
Executed: 2022-09-27
LIN, YU-HSIEN
Executed: 2022-09-27
CHEN, RYAN CHIA-JEN
Executed: 2022-09-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices and Methods of Manufacturing Thereof