Patent Assignment
Reel/Frame 062779/0987
Assignment of Assignor's Interest
Recorded: 2023-02-23
Pages: 4
Assignors
YANG, SHENG-CHUN
Executed: 2020-03-03
LIN, YI-MING
Executed: 2020-03-03
LIANG, PO-WEI
Executed: 2020-03-04
HSIEH, CHU-HAN
Executed: 2020-03-03
CHENG, CHIH-LUNG
Executed: 2020-03-03
HUANG, PO-CHIH
Executed: 2020-03-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD.6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Manufacturing Semiconductor Wafer with Wafer Chuck Having Fluid Guiding Structure