Patent Assignment
Reel/Frame 062810/0596
Assignment of Assignor's Interest
Recorded: 2023-02-27
Pages: 6
Assignors
YIM, CHOONGBIN
Executed: 2022-12-26
PARK, JI-YONG
Executed: 2022-12-26
PARK, JIN-WOO
Executed: 2022-12-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same
Application:
18/174,992 →
Publication:
US 2023/0402358