Patent Assignment
Reel/Frame 062819/0588
Assignment of Assignor's Interest
Recorded: 2022-10-19
Pages: 13
Assignors
MCELHINNY, KYLE
Executed: 2021-09-17
FENG, HONGXIA
Executed: 2021-10-08
GUO, XIAOYING
Executed: 2021-09-24
CHO, STEVE
Executed: 2021-09-27
HAN, JUNG KYU
Executed: 2021-09-20
LIU, CHANGHUA
Executed: 2021-09-20
ARANA, LEONEL
Executed: 2021-09-17
MANEPALLI, RAHUL
Executed: 2021-09-23
XU, DINGYING
Executed: 2021-09-27
EITAN, AMRAM
Executed: 2023-02-25
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods and Apparatus to Reduce Defects in Interconnects Between Semicondcutor Dies and Package Substrates
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.