IP Library › Assignment 062840/0785
Patent Assignment
Reel/Frame 062840/0785

Assignment of Assignor's Interest

Recorded: 2023-03-01 Pages: 7
Assignors
LIN, YU-SHENG
Executed: 2022-04-24
YEH, SHU-SHEN
Executed: 2022-10-24
WANG, CHIN-HUA
Executed: 2022-04-24
LIN, PO-YAO
Executed: 2022-04-24
JENG, SHIN-PUU
Executed: 2022-04-24
CHEN, CHIEN HUNG
Executed: 2022-09-28
HSU, CHIA-KUEI
Executed: 2022-10-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property (1)
Package Assembly Including Lid With Additional Stress Mitigating Feet And Methods Of Making The Same
Application: 17/748,335 →
Publication: US 2023/0018343
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Add the 8TH and 9TH Assignors Names Previously Recorded on Reel 62840 Frame 785. Assignor(S) Hereby Confirms the the Assignment. Apr 16, 2025
From: LIN, YU-SHENG; YEH, SHU-SHEN; WANG, CHIN-HUA; LIN, PO-YAO
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Reel/Frame 070878/0618 →