IP Library › Assignment 070878/0618
Patent Assignment
Reel/Frame 070878/0618

Corrective Assignment to Add the 8TH and 9TH Assignors Names Previously Recorded on Reel 62840 Frame 785. Assignor(S) Hereby Confirms the the Assignment.

Recorded: 2025-04-16 Pages: 9
Assignors
LIN, YU-SHENG
Executed: 2022-04-24
YEH, SHU-SHEN
Executed: 2022-10-24
WANG, CHIN-HUA
Executed: 2022-04-24
LIN, PO-YAO
Executed: 2022-04-24
JENG, SHIN-PUU
Executed: 2022-04-24
CHEN, CHIEN HUNG
Executed: 2022-09-28
HSU, CHIA-KUEI
Executed: 2022-10-26
LAI, PO-CHEN
Executed: 2025-04-13
LEE, YU CHEN
Executed: 2025-04-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property (1)
Package Assembly Including Lid With Additional Stress Mitigating Feet And Methods Of Making The Same
Application: 17/748,335 →
Publication: US 2023/0018343
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 1, 2023
From: LIN, YU-SHENG; YEH, SHU-SHEN; WANG, CHIN-HUA; LIN, PO-YAO
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Reel/Frame 062840/0785 →