Patent Assignment
Reel/Frame 062841/0509
Assignment of Assignor's Interest
Recorded: 2023-03-01
Pages: 4
Assignors
JUANG, JING-YE
Executed: 2022-10-26
HSU, CHIA-KUEI
Executed: 2022-05-19
YEW, MING-CHIH
Executed: 2022-05-19
CHEN, HSIEN-WEI
Executed: 2022-05-19
JENG, SHIN-PUU
Executed: 2022-05-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Dual-Underfill Encapsulation for Packaging and Methods of Forming the Same