Patent Assignment
Reel/Frame 062856/0057
Assignment of Assignor's Interest
Recorded: 2023-03-02
Pages: 6
Assignors
NAKAMURA, NOBUO
Executed: 2023-02-04
ITAGAKI, TOSHIKI
Executed: 2023-01-20
MIYAMOTO, TAKASHI
Executed: 2023-01-19
HOTTA, SHIN
Executed: 2023-01-19
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Solid-State Imaging Device, Signal Processing Method, and Electronic Device