Patent Assignment
Reel/Frame 062862/0189
Assignment of Assignor's Interest
Recorded: 2023-03-02
Pages: 4
Assignors
PARK, JUNGMIN
Executed: 2023-01-18
LIM, HANJIN
Executed: 2023-01-18
JUNG, HYUNGSUK
Executed: 2023-01-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same