Patent Assignment
Reel/Frame 062874/0247
Assignment of Assignor's Interest
Recorded: 2023-03-03
Pages: 4
Assignors
HIRAMATSU, TOMOKI
Executed: 2023-02-06
TOGASHI, HIDEAKI
Executed: 2023-02-01
KAWAI, NOBUHIRO
Executed: 2023-02-03
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Solid-State Imaging Device and Electronic Apparatus