Patent Assignment
Reel/Frame 062903/0823
Assignment of Assignor's Interest
Recorded: 2023-03-07
Pages: 3
Assignors
TAPILY, KANDABARA
Executed: 2023-03-07
SMITH, JEFFREY
Executed: 2023-03-07
CLARK, ROBERT
Executed: 2023-03-06
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method of Forming a Semiconductor Device with Air Gaps for Low Capacitance Interconnects
Application:
18/179,518 →
Publication:
US 2023/0290677