Patent Assignment
Reel/Frame 062928/0309
Assignment of Assignor's Interest
Recorded: 2023-03-09
Pages: 6
Assignors
KIM, JINGU
Executed: 2022-12-16
KWON, YIEOK
Executed: 2022-12-15
LEE, SANGKYU
Executed: 2022-12-15
JEONG, TAESUNG
Executed: 2022-12-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having Organic Material Layer Between Through-via Structure and Encapsulant That Surrounds a Portion of Semiconductor Chip