Semiconductor packages having organic material layer between through-via structure and encapsulant that surrounds a portion of semiconductor chip
A semiconductor package includes a first redistribution structure including a first redistribution layer; a semiconductor chip on a first surface of the first redistribution structure and including a connection pad electrically connected to the first redistribution layer; an encapsulant that surrounds at least a portion of the semiconductor chip; a second redistribution structure on the encapsulant and including a second redistribution layer; a through-via structure that extends through the encapsulant and electrically connects the first redistribution layer to the second redistribution layer; an organic material layer between the through-via structure and the encapsulant and having an elongation rate greater than an elongation rate of the encapsulant; and a bump structure on a second surface of the first redistribution structure.
1 . A semiconductor package, comprising:
a first redistribution structure including a first redistribution layer;
a semiconductor chip on a first surface of the first redistribution structure and including a connection pad electrically connected to the first redistribution layer;
an encapsulant that surrounds at least a portion of the semiconductor chip;
a second redistribution structure on the encapsulant and including a second redistribution layer;
a through-via structure that extends through the encapsulant and electrically connects the first redistribution layer to the second redistribution layer;
an organic material layer between the through-via structure and the encapsulant and having an elongation rate greater than an elongation rate of the encapsulant; and
a bump structure on a second surface of the first redistribution structure,
wherein the organic material layer includes a compound having a mercapto group or a phosphate compound,
wherein the mercapto group includes at least one of 2-mercapto-5-methoxy benzimidazole, 2-mercapto-1-methylimidazole, 2-mercapto-5-methoxy benzothiazole, or 3-mercaptopropyl(dimethoxy)methylsilane, and
wherein the phosphate compound includes triphenyl phosphate.
2 . The semiconductor package of claim 1 , wherein the encapsulant includes an insulating resin impregnated with an inorganic filler.
3 . The semiconductor package of claim 2 , wherein the encapsulant includes an Epoxy Molding Compound.
4 . The semiconductor package of claim 1 , wherein the elongation rate of the organic material layer is 3% or more.
5 . The semiconductor package of claim 4 , wherein the elongation rate of the organic material layer is in a range of 3% to 20%.
6 . The semiconductor package of claim 1 , wherein the organic material layer extends along an outer surface of the through-via structure, the outer surface of the through-via structure extending perpendicularly to the first surface of the first redistribution structure.
7 . The semiconductor package of claim 1 , wherein at least a portion of the organic material layer is in contact with the first surface of the first redistribution structure.
8 . The semiconductor package of claim 1 , wherein at least a portion of the organic material layer extends to a side surface of the encapsulant.
9 . The semiconductor package of claim 1 ,
wherein the first redistribution layer includes a first pad portion on the first surface of the first redistribution structure, and
wherein a first barrier layer is on the first pad portion.
10 . The semiconductor package of claim 9 , wherein the first barrier layer includes nickel (Ni), gold (Au), or alloys thereof.
11 . The semiconductor package of claim 9 , wherein the semiconductor chip further includes a connection bump in contact with the first barrier layer and the connection pad.
12 . The semiconductor package of claim 1 ,
wherein the second redistribution layer includes a second pad portion on the second redistribution structure, and
wherein a second barrier layer is on the second pad portion.
13 . The semiconductor package of claim 1 ,
wherein the first redistribution structure further includes a first redistribution via electrically connected to the first redistribution layer, and
wherein the first redistribution via is in direct contact with the connection pad.
14 . A semiconductor package, comprising:
a first redistribution structure including a first redistribution layer;
a semiconductor chip on the first redistribution structure and electrically connected to the first redistribution layer;
a second redistribution structure on the semiconductor chip and including a second redistribution layer;
through-via structures between the first redistribution structure and the second redistribution structure and electrically connecting the first redistribution layer to the second redistribution layer;
an organic material layer on the through-via structures and including an organic compound; and
an encapsulant in a space between the first redistribution structure and the second redistribution structure and on the organic material layer,
wherein the organic material layer includes a compound having a mercapto group or a phosphate compound,
wherein the mercapto group includes at least one of 2-mercapto-5-methoxy benzimidazole, 2-mercapto-1-methylimidazole, 2-mercapto-5-methoxy benzothiazole, or 3-mercaptopropyl(dimethoxy)methylsilane, and
wherein the phosphate compound includes triphenyl phosphate.
15 . The semiconductor package of claim 14 ,
wherein the through-via structures include a first through-via structure and a second through-via structure adjacent to each other, and
wherein the organic material layer includes a first portion on the first through-via structure and a second portion on the second through-via structure.
16 . The semiconductor package of claim 15 , wherein the organic material layer further includes a third portion extending along a first surface of the first redistribution structure and connecting the first portion to the second portion.
17 . A semiconductor package, comprising:
a first redistribution structure including a first redistribution layer;
a semiconductor chip on the first redistribution structure and electrically connected to the first redistribution layer;
a second redistribution structure on the semiconductor chip and including a second redistribution layer;
a through-via structure between the first redistribution structure and the second redistribution structure and electrically connecting the first redistribution layer to the second redistribution layer;
an organic material layer extending along a side surface of the through-via structure and including a compound having a mercapto group or a phosphate compound; and
an encapsulant in a space between the first redistribution structure and the second redistribution structure and in contact with the organic material layer,
wherein the mercapto group includes at least one of 2-mercapto-5-methoxy benzimidazole, 2-mercapto-1-methylimidazole, 2-mercapto-5-methoxy benzothiazole, or 3-mercaptopropyl(dimethoxy)methylsilane, and
wherein the phosphate compound includes triphenyl phosphate.