Patent Assignment
Reel/Frame 062937/0682
Assignment of Assignor's Interest
Recorded: 2023-03-09
Pages: 5
Assignors
HSIUNG, TE-CHIH
Executed: 2022-09-29
CHEN, YUN-HUA
Executed: 2022-09-29
WU, BING-SIAN
Executed: 2022-09-29
CHIU, YI-HSUAN
Executed: 2022-09-29
CHANG, YU-WEI
Executed: 2022-10-02
HSIEH, WEN-KUO
Executed: 2022-09-29
TING, CHIH-YUAN
Executed: 2022-09-29
LIN, HUAN-JUST
Executed: 2022-09-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Application:
18/180,720 →
Publication:
US 2024/0120203