Patent Assignment
Reel/Frame 062972/0577
Assignment of Assignor's Interest
Recorded: 2023-03-14
Pages: 4
Assignors
LU, WEN-HSIUNG
Executed: 2022-10-16
CHENG, MING-DA
Executed: 2022-10-16
LIN, CHIA-LI
Executed: 2023-03-13
HUANG, YU-CHIH
Executed: 2022-11-21
CHEN, CHEN-SHIEN
Executed: 2022-10-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Die Bonding Pads and Methods of Forming the Same