Patent Assignment
Reel/Frame 062974/0530
Assignment of Assignor's Interest
Recorded: 2023-03-14
Pages: 4
Assignors
LIAO, LI-LING
Executed: 2020-12-24
YEW, MING-CHIH
Executed: 2020-12-25
HSU, CHIA-KUEI
Executed: 2020-12-25
YEH, SHU-SHEN
Executed: 2020-12-25
LIN, PO-YAO
Executed: 2020-12-25
JENG, SHIN-PUU
Executed: 2020-12-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Organic Interposer Including Intra-Die Structural Reinforcement Structures and Methods of Forming the Same