Patent Assignment
Reel/Frame 063014/0130
Assignment of Assignor's Interest
Recorded: 2023-03-17
Pages: 4
Assignors
KOMATSU, FUTOSHI
Executed: 2022-12-21
NAKAYAMA, TOMOO
Executed: 2022-12-20
UCHIMURA, KATSUHIRO
Executed: 2022-12-21
INAGAWA, HIROSHI
Executed: 2022-12-21
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOTO-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device