Patent Assignment
Reel/Frame 063023/0765
Assignment of Assignor's Interest
Recorded: 2023-03-17
Pages: 3
Assignor
CHANG, WEI-HAO
Executed: 2023-02-22
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANZIH DIST., KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same
Application:
18/111,433 →
Publication:
US 2024/0282715