Semiconductor device package and method of manufacturing the same
A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, a second carrier disposed over the first carrier, and a reinforcement connected to the second carrier and configured to prevent the second carrier from being recessed toward the first carrier.
1 . An electronic device, comprising:
a first carrier;
a second carrier disposed over the first carrier; and
a reinforcement connected to the second carrier and configured to prevent the second carrier from being recessed toward the first carrier;
wherein the reinforcement covers a lateral surface of the second carrier
wherein the electronic device further comprises a first encapsulant covering the reinforcement and spaced apart from the lateral surface of the second carrier.
2 . The electronic device of claim 1 , further comprising a first electronic component connected to the first carrier, a second electronic component disposed over the first electronic component and connected to the second carrier and a third electronic component encapsulated by the reinforcement.
3 . The electronic device of claim 1 , wherein a hardness of the first carrier is greater than a hardness of the second carrier.
4 . The electronic device of claim 1 , wherein a thickness of the first carrier is greater than a thickness of the second carrier.
5 . The electronic device of claim 1 , wherein the second carrier comprises a plurality of conductive vias tapered toward the first carrier.
6 . The electronic device of claim 1 , wherein the first encapsulant covers a lateral surface of the first carrier.
7 . The electronic device of claim 6 , further comprising
an electrical connection disposed under the first carrier; and
a second encapsulant encapsulating the electrical connection.
8 . The electronic device of claim 6 , further comprising a fourth electronic component disposed under the first carrier, wherein the first encapsulant is disposed under the first carrier and covers the fourth electronic component.
9 . The electronic device of claim 1 , wherein the second carrier comprises a first dielectric layer and a second dielectric layer, and wherein the first dielectric layer is closer to the first carrier than the second dielectric layer and a thickness of the first dielectric layer is greater than a thickness of the second dielectric layer.
10 . An electronic device, comprising:
a coreless substrate;
at least one electronic component mounted on the coreless substrate;
at least one support element configured to support the coreless substrate;
a reinforcement connected to the coreless substrate and configured to prevent the coreless substrate from collapsing due to a weight of the at least one electronic component; and
a core substrate supporting the support element, wherein the core substrate comprises a first dielectric layer with a first thickness and the coreless substrate comprises a second dielectric layer with a second thickness, and wherein the first thickness is greater than the second thickness.
11 . The electronic device of claim 10 , wherein a width of the core substrate is less than a width of the coreless substrate in a cross-sectional view.
12 . The electronic device of claim 11 , further comprising an encapsulant covering the coreless substrate, at least one electronic component, the reinforcement and the core substrate.