Patent Assignment
Reel/Frame 063033/0080
Assignment of Assignor's Interest
Recorded: 2023-03-20
Pages: 6
Assignors
CHANG, YAO-CHUNG
Executed: 2022-07-04
LIU, SHIH-CHIEN
Executed: 2022-06-26
YU, CHIA-JUI
Executed: 2023-02-19
TSAI, CHUN-LIN
Executed: 2022-06-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
3D Ic Comprising Semiconductor Substrates with Different Bandgaps