Patent Assignment
Reel/Frame 063052/0423
Change of Name
Recorded: 2023-03-10
Pages: 11
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Liquid Resin Composition for Sealing and Electronic Component Apparatus
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 2, 2019
From: INOUE, HIDETOSHI; MATSUZAKI, TAKAYUKI; TAKAHASHI, HISATO; KAMIMURA, TSUYOSHI
To: HITACHI CHEMICAL COMPANY, LTD.; NAMICS CORPORATION
Reel/Frame 051152/0904 →
Change of Name
Nov 18, 2022
From: HITACHI CHEMICAL CO., LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061967/0148 →
Change of Name
Mar 6, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062956/0775 →
Change of Name
Mar 7, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062901/0765 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →