Patent Assignment
Reel/Frame 063068/0440
Assignment of Assignor's Interest
Recorded: 2023-03-23
Pages: 4
Assignors
SHENG, BEIBEI
Executed: 2022-07-20
HU, SHENG
Executed: 2022-07-20
LIU, TIANJIAN
Executed: 2022-07-20
Assignee
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 18 GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE, WUHAN, HUBEI, 430205, CHINA
Covered Property
(1)
Wafer Matching Design Method, Wafer Bonding Structure and Chip Bonding Structure
Application:
18/025,290 →
Publication:
US 2023/0335504