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Patent Assignment
Reel/Frame 063110/0905

Assignment of Assignor's Interest

Recorded: 2023-03-27 Pages: 3
Assignors
YANG, TIEN CHU
Executed: 2023-03-17
YANG, CHIN CHENG
Executed: 2022-03-22
Assignee
MACRONIX INTERNATIONAL CO., LTD.
NO.16, LI HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property (1)
Compensation Method for Wafer Bonding
Application: 18/190,206 →
Publication: US 2024/0332246