Patent Assignment
Reel/Frame 063157/0615
Assignment of Assignor's Interest
Recorded: 2023-03-29
Pages: 4
Assignors
CHIANG, YUEH
Executed: 2023-03-26
CHIU, SHANG-HSUAN
Executed: 2023-03-27
LU, MING-XIANG
Executed: 2023-03-26
WANG, GUANG-CHENG
Executed: 2023-03-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit and Method of Forming the Same