Patent Assignment
Reel/Frame 063262/0056
Assignment of Assignor's Interest
Recorded: 2023-04-07
Pages: 5
Assignor
CHANG, GUNHO
Executed: 2023-03-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same
Application:
18/132,171 →
Publication:
US 2024/0071951