IP Library › Assignment 063270/0604
Patent Assignment
Reel/Frame 063270/0604

Change of Name

Recorded: 2023-04-07 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Direct Bonded Stack Structures for Increased Reliability and Improved Yield in Microelectronics
Application: 17/681,563 →
Publication: US 2022/0293567
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 7, 2023
From: UZOH, CYPRIAN EMEKA; KATKAR, RAJESH; WORKMAN, THOMAS; GAO, GUILIAN
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 063258/0121 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →