Patent Assignment
Reel/Frame 063289/0804
Assignment of Assignor's Interest
Recorded: 2023-04-11
Pages: 4
Assignors
YANG, CHE WEI
Executed: 2023-03-29
WU, KUO-MING
Executed: 2023-03-29
CHEN, SHENG-CHAU
Executed: 2023-03-29
TSAI, CHENG-YUAN
Executed: 2023-04-05
HSIAO, HAU-YI
Executed: 2023-03-29
YU, CHUNG-YI
Executed: 2023-04-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Supporting Sealant Layer Structure for Stacked Die Application
Application:
18/298,064 →
Publication:
US 2024/0339422