Patent Assignment
Reel/Frame 063350/0752
Assignment of Assignor's Interest
Recorded: 2023-04-17
Pages: 7
Assignors
BAEK, JONGHWAN
Executed: 2020-12-21
PARK, JEONGHYUK
Executed: 2020-12-18
IM, SEUNGWON
Executed: 2020-12-21
LEE, KEUNHYUK
Executed: 2020-12-18
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Dual Cool Power Module with Stress Buffer Layer