Assignment of Assignor's Interest

Recorded: 2023-04-20 Pages: 7

Assignors

NALAMALPU, ANKIREDDY

Executed: 2023-01-09

KUMASHIKAR, MAHESH K.

Executed: 2023-01-16

MAHESHWARI, ATUL

Executed: 2023-03-16

TANG, LAI GUAN

Executed: 2022-09-30

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Die-to-Die Interconnect Architecture for Hardware-Agnostic Modeling

Application: 17/956,372 →

Publication: US 2023/0042718

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.